http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102516876-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ee33b0e3e7398cf6fc957eeee59d510 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2eb97facd58745a89234cb58ac115cf1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1b0e6fd2db5f8791ff0d2ab2f9646353 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2011-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1ab0b5fec6eb63925ea4834dc7d66e7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0903d077521c7b843d32a9697b3c5faf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4d73caf6245b4d5d4d03e1ce1e66f1d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c5aae2f05a6afa84cc3f473c37f5f8d |
| publicationDate | 2014-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102516876-B |
| titleOfInvention | Polishing composition for silicon wafer polishing and preparation method thereof |
| abstract | The invention discloses a polishing composition for silicon wafer polishing and a preparation method thereof, belonging to the technical field of chemical-mechanical polishing. The polishing composition is composed of the following components in percentage by weight: 0.05-50% of abrasive material namely functionalized silicon dioxide sol, 0.001-10% of silicic acid modifying agent, 0.001-1% of polishing mat preservative, 0.001-10% of basic compound, 0.001-1% of surfactant and the balance of deionized water. According to the invention, the functionalized silicon dioxide sol in the polishing composition can reduce the number of exposed Si-OH and reduce the reaction activity of polished silicon dioxide particles in generating silicic acid, so that the deposition, caused by silicic acid action, of silicon dioxide particles on the surface of a polishing mat in the polishing process is avoided; and compared with the conventional polishing solution, the polishing composition reduces the probability of blocking the pore channels of the polishing mat. |
| priorityDate | 2011-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 124.