http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102504532-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6a73440018eca5d3e92ae110c26dbb1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L47-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-521 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_187f377bbc467107f35ee3cd47b76eaf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_367116936e49048e74472ff57f23254f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2a22eb6b1ab8f962394351a75771de9 |
| publicationDate | 2013-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102504532-B |
| titleOfInvention | Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same |
| abstract | The invention relates to a halogen-free low dielectric resin composition and a prepreg and copper clad laminate made of the same. The halogen-free low dielectric resin composition comprises the following components in part by weight of organic solid content: 5 to 90 parts by weight of epoxidized polybutadiene resin, 10 to 90 parts by weight of benzoxazine resin, 10 to 90 parts by weight of epoxy resin, 1 to 50 parts by weight of curing agent, 10 to 50 parts by weight of organic flame retardant, 0.001 to 1 part by weight of curing accelerator, 0.1 to 10 parts by weight of initiator and 10 to 100 parts by weight of fillings. Due to the adoption of the epoxidized polybutadiene in the halogen-free low dielectric resin composition disclosed by the invention, not only are the defects of polybutadiene improved, but also the advantages on the aspects of dielectric and flexibility are well kept and the adhesion force between the halogen-free low dielectric resin composition and a copper foil is improved; and the prepreg and copper clad laminate for a printed circuit board, which is made of the resin composition, has excellent dielectric performance, good heat resistance and high glass transition temperature and the requirements on the high frequency of transmission of an electronic signal and high speed of information processing in the industry of the printed circuit copper clad laminate can be met. |
| priorityDate | 2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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