http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102498155-B

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e91c874824fe20ef5f1e2ed387686c39
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33ea692ee9ed94ac0274714abf621797
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
filingDate 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21ebdbe6417bb15b4cfea6e4968c0705
publicationDate 2014-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102498155-B
titleOfInvention Organic-solvent-soluble polyimide comprising PMDA, DADE, BPDA, and BCD
abstract Disclosed is an organic-solvent-soluble, heat-resistant polyimide that comprises (a) a pyromellitic dianhydride (PMDA), (b) a biphenyl tetracarboxylic dianhydride (BPDA), (c) a bicyclooctene tetracarboxylic dianhydride (BCD), and (d) a diaminodiphenyl ether (DADE) as components. The organic-solvent-soluble, heat-resistant polyimide has a thermal decomposition initiation temperature in the range of 530 DEG C to 570 DEG C and is synthesized by means of a three-step hydrogenation reaction: in the first step, a low molecular weight imide compound is generated by the reaction of an acid dianhydride and an aromatic diamine; in the second step, a low molecular weight imide compound is generated by further reacting an acid dianhydride and an aromatic diamine with the low molecular weight imide compound generated in the first step; and in the third step, a polycondensation reaction is performed.
priorityDate 2009-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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