| abstract |
Provided is an LED equipment purpose wafer having a small difference in coefficient of linear thermal expansion from an LED and having an excellent heat conductivity, a method for manufacturing the LED equipment purpose wafer, and an LED-equipped structure manufactured by using the LED equipment purpose wafer. The LED equipment purpose wafer (6) is constituted of a metal impregnation ceramic complex (61) and a protection layer (62) that is formed therearound. It is preferable that the metal impregnation ceramic complex (61) has a metal thin layer (63) on a surface thereof. The method for manufacturing the wafer is characterized by comprising filling at least one selected from the group consisted of ceramic porous bodies, ceramic powder compacts, and ceramic powders into a tubular body made of metal or ceramic, then impregnating metal into a gap portion held by at least one selected from the group consisted of the ceramic porous bodies, the ceramic powder compacts, and the ceramic powders, and thereafter performing a process. |