| abstract |
Disclosed are: a photosensitive composition which enables the formation of a resist film having excellent heat cracking resistance; and a printed wiring board produced using the photosensitive composition. The photosensitive composition comprises a resin having an aromatic ring and containing a carboxyl group, titanium oxide, a compound having a cyclic ether skeleton, and a photopolymerization initiator. The printed wiring board comprises a printed wiring board main body having a circuit formed on the surface thereof, and a resist film (3) laminated on the surface of the printed wiring board main body on which the circuit has been provided. The resist film (3) is formed using the photosensitive composition. |