| abstract |
Disclosed are a sealing glass, a sealing material and a sealing material paste for semiconductor devices, all of which enable the prevention of the precipitation of a metal caused by the reduction of a glass component (a metal oxide) without deteriorating the reactivity with a semiconductor substrate or the adhesiveness to a semiconductor substrate. The sealing glass for semiconductor devices comprises a low-melting-point glass having a softening point of 430 DEG C or lower. The low-melting-point glass comprises, in mass%, 0.1 to 5% of oxide of at least one metal selected from the group consisting of Fe, Mn, Cr, Co, Ni, Nb, Hf, W, Re and rare earth elements and 5 to 100 ppm of K2O. In the sealing glass, Mo may be added to the above-mentioned group. The sealing material for semiconductor devices comprises the sealing glass and an inorganic filler in an amount of 0 to 40 vol%. The sealing material paste for semiconductor devices comprises a mixture of the sealing material and a vehicle. |