http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102446811-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d0a3d10ed9477633fd2c07c6da61dc49 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2010-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_671ab83ae7c616c8d986a07c5f5456a3 |
| publicationDate | 2014-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102446811-B |
| titleOfInvention | Metal interconnecting structure and methods for forming metal interlayer through holes and interconnecting metal wire |
| abstract | The invention discloses a method for forming metal interlayer through holes, a method for forming an interconnecting metal wire and a metal interconnecting structure. The method for forming the metal interlayer through holes comprises the following steps of: forming a seed crystal layer on a first dielectric layer and a first metal layer, wherein the first metal layer is embedded into the first dielectric layer; forming a mask diagram on the seed crystal layer, wherein the mask diagram exposes a part of the seed crystal layer, and the exposed seed crystal layer covers a part of the first metal layer; growing a second metal layer on the exposed seed crystal layer; removing the mask diagram and the seed crystal layer which bears the mask diagram to expose the side wall of the second metal layer, a part of the first metal layer and the first dielectric layer; and forming a barrier layer on the side wall, the part of the first metal layer and the first dielectric layer. The method for forming the interconnecting metal wire can reduce holes. The metal interconnecting structure comprises a contact plug, through holes and the interconnecting metal wire, wherein the through holes are formed in the interconnecting metal wire, a metal grid and/or the contact plug. |
| priorityDate | 2010-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.