| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cb2503c8bbb5986aa5ecfb23e0e25eb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0884
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-0884
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0869 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L49-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-06 |
| filingDate |
2010-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a06365c39b449a3cef5547445ed14601
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cca98ca4874d44f03ed66611c7fbce3 |
| publicationDate |
2014-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102428138-B |
| titleOfInvention |
Encapsulant compositions, methods of manufacture and uses thereof |
| abstract |
Disclosed is an encapsulant composition containing about 15 to about 50 wt% of an ethylene/ethyl acrylate/maleic anhydride copolymer containing about 20 to about 40 wt% of an ethylene/glycidyl (meth)acrylate copolymer; about 2 to about 30 wt% of an ethylene/butyl acrylate/maleic anhydride copolymer; about 5 to about 50 wt% of polyethylene, about 0.05 to about 5 wt% of an adhesion promoter; and optionally about 0.01 to about 2 wt% of at least one additive. The composition is useful for encapsulating thin film devices. The disclosure also relates to a method of encapsulating thin film devices with the composition and to devices produced by the method. |
| priorityDate |
2009-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |