http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102424738-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_288e531d12b5a826b57d81333838b46c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 |
| filingDate | 2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5b11936c17ef960911421d9cc56e0bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab450cac879b2703d591e951794ee0ef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fde547d9c7816c9a83e2e6367b223d14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d53239e0a13235fb2e79e5aa644a0e5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c295adbbfa5b6868bfcd308323b6b1b |
| publicationDate | 2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102424738-B |
| titleOfInvention | High-elasticity solvent-free nanometer modified epoxy resin as well as preparation method and application thereof |
| abstract | The invention discloses high-elasticity solvent-free nanometer modified epoxy resin as well as a preparation method and an application thereof. The modified epoxy resin is formed by mixing components A with components B, wherein the components A are obtained by mixing and grinding modified epoxy resin, moistening agents, fillings, pigment, defoaming agents and catalysts, the components B are obtained through the steps that phenol and alicyclic amine are mixed, paraformaldehyde is added, the reflux reaction is carried out, adhesive force accelerating agents and catalysts are added, and the components B are obtained after stirring the mixture. The high-elasticity solvent-free nanometer modified epoxy resin has the solid content being higher than 98 percent and belongs to a solvent-free product, and the one-step thick coating formation of 1.5 to 2mm can be realized; the fracture elongation is higher and reaches higher than 250 percent, and the modified epoxy resin belongs to a high-elasticity modified epoxy resin product; the fracture strength is high, and the waterproofness is good (waterproofness is kept at the constant pressure being 0.8MPa for 2h); the bonding force of the humid surface reaches 2.5MPa; the corrosion medium resistance is high; and the aging resistance and the heat moisture performance are high, and the tensile-strength and the fracture elongation can be maintained for being higher than 80 percent after ageing at 80 DEG C for 168h. |
| priorityDate | 2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.