http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102395924-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9de52bba13e16028dffa8775e3f3f28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D241-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D241-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2010-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6969890fe90bc9c5a00eb07f88330c31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba7e72ffbe783aa4637e6f52cde746d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed6c92face8e89ffb77bb7f4299b86a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_776d5fb213a252e2398d31e4205939c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86cae01ac0211e026fef0b013a5806d0 |
| publicationDate | 2013-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102395924-B |
| titleOfInvention | Photosensitive resin composition, photosensitive element utilizing the composition, method for formation of resist pattern, and process for production of printed circuit board |
| abstract | Disclosed is a photosensitive resin composition comprising a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and at least one pyrazine compound selected from the group consisting of compounds each having a structure represented by formula (1), compounds each having a structure represented by formula (2) and compounds each having a structure represented by formula (3). [In formulae (1) to (3), R1 to R12 independently represent a univalent organic group containing an alkyl group, a cycloalkyl group, a phenyl group, a naphthyl group or a heterocyclic group, wherein R1 and R2, R3 and R4, R5 and R6, R7 and R8, R9 and R10, or R11 and R12 may be bound to each other and, together with two carbon atoms contained in a pyrazine skeleton, form a ring. In formula (2), X and Y independently represent an atom group that constitutes an aromatic ring formed together with two carbon atoms contained in a pyrazine skeleton and having a monocyclic or condensed polycyclic structure. In formula (3), Z represents an atom group that constitutes an aromatic ring having a monocyclic or condensed polycyclic structure and formed together with four carbon atoms contained in a pyrazine skeleton or a hetero ring. |
| priorityDate | 2009-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 161.