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filingDate 2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102377401-B
titleOfInvention The manufacture method of electronic device, electronic equipment and electronic device
abstract Problem of the present invention is, possessing the electronic unit, the outer electrode arranged in the opposition side of the electro part carrying side of substrate and with the electronic device of the through electrode of substrate deposition that carry in substrate, guarantees the conducting of electronic unit and outer electrode.Electronic device provided by the invention comprises: substrate (10); Through substrate (10) and removed the through electrode (21) of insulating properties material of end face by grinding; Circuit pattern (30) is formed at an end face of through electrode (21), and the electronic unit (40) arranged by the internal wiring (31) of the upper formation of circuit pattern (30); Arranging with the opposition side, side arranging electronic unit (40) and forming the electrode pattern (60) be connected with another end face of through electrode (21) and the outer electrode (61) above formed at electrode pattern (60) in substrate (10); And to engage with substrate and the lid (50) of electronic unit (40) on (10) at the bottom of protecting group.
priorityDate 2010-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 51.