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filingDate 2011-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b03bb56cd72442f07d372ea31432bcd6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42a833fbab35ac9c74680b0d117667fd
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publicationDate 2014-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102344765-B
titleOfInvention Formaldehyde-inhibiting composite clay adhesive filler
abstract The invention discloses composite silica-magnesia clay urea-formaldehyde resin adhesive filler for inhibiting emission of free formaldehyde. The filler is prepared from 30-70 percent of modified attapulgite powder, 0-50 percent of modified sepiolite powder and 15-30 percent of vegetable protein powder, wherein the total percentage of the components is 100 percent. According to the composite silica-magnesia clay urea-formaldehyde resin adhesive filler disclosed by the invention, natural attapulgite and sepiolite mineral powder with abundant reservation, wide distribution range and low price are used as raw materials; urea with the characteristic of specifically absorbing the formaldehyde is infiltrated; the surface of the powder is modified by using a silane coupling agent with a function of improving the affinity of the filler and a urea-formaldehyde resin adhesive; and when the silane coupling agent is used for organic filler to fill the adhesive, the dispersability and the adhesiveness of the filler can be improved. The processing technique is easy to realize continuous industrial production and avoid three-waste discharge.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109265069-B
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type http://data.epo.org/linked-data/def/patent/Publication

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