| abstract |
Disclose a kind of semiconductor device, this semiconductor device has the anti-whisker of improvement in outside plated film.This semiconductor device comprise the thin slice that semiconductor chip is fixed thereon, multiple lead, the multiple outer leads be integrally formed with lead, for by the electrode pad of semiconductor chip and lead multiple wiring coupled to each other and the seal being used for sealing semiconductor chips.Outer lead is given prominence to from seal and is formed the outside plated film as unleaded plated film on the surface of each outer lead.In outside plated film, diameter be not more than 1 μm and the number of dies that interface side in the thickness direction of outside plated film exists than being not more than 1 μm and the number of dies existed in the face side of outside plated film is large, make the difference of the linear expansion coefficient between outside plated film and outer lead less thus, thus make it possible to the growth of inhibition of whiskers. |