| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 |
| filingDate |
2010-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e013a9eed35833d1cd1accc769d86fc8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0ec5072a8a8361337d469d41367b408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc51c09347a141a175979c328057fbfa |
| publicationDate |
2015-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102318042-B |
| titleOfInvention |
Polishing agent for copper polishing and polishing method using same |
| abstract |
Disclosed is a polishing agent for copper polishing, which contains (A) a divalent or higher-valent inorganic acid, (B) an amino acid, (C) a protective film-forming agent, (D) abrasive grains, (E) an oxidizing agent and (F) water. The component (A) is contained in an amount of not less than 0.08 mol/kg, the component (B) is contained in an amount of not less than 0.20 mol/kg, and the component (C) is contained in an amount of not less than 0.02 mol/kg. The polishing agent for copper polishing satisfies at least either of the following condition (i) or (ii). (i) The ratio of the content of the component (A) to the content of the component (C) is not less than 2.00. (ii) The polishing agent for copper polishing additionally contains (G) at least one substance selected from among organic acids and acid anhydrides thereof. |
| priorityDate |
2009-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |