| abstract |
An embodiment in the invention discloses a forming method for a semiconductor pipe core and a conductive pillar. The semiconductor pipe core comprises a conductive pillar disposed at the semiconductor pipe core. A substrate is provided. A bond pad is over the substrate. A conductive pillar is over the bond pad. The conductive pillar has a top surface, edge sidewalls and a height. A cap layer is over the top surface of the conductive pillar. The cap layer extends along the edge sidewalls of the conductive pillar for a length. A solder material is over a top surface of the cap layer. The method provided in the invention can improve the structure and forming method of a copper pillar and can be applied in a semiconductor chip, making the semiconductor chip be provided with strong electric efficiency. |