| abstract |
The present invention relates to an adhesive composition, a circuit connecting material, a connecting structure of a circuit member, and a semiconductor device. The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000, wherein the urethane (meth)acrylate includes a urethane (meth)acrylate with a divalent organic group in the molecule represented by the following formula (B) and/or the following general formula (C). In formula (C), R<5> and R<6> respectively represent hydrogen and methyl or methyl and hydrogen. |