http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102272677-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-161 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2009-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f89a4af39dd9dacc3355fd95ae0168a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1f080ffca83a23c94d07e5772dda9e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac |
| publicationDate | 2013-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102272677-B |
| titleOfInvention | Photocurable resin composition, dry film and cured product of the photocurable resin composition, and printed wiring board using the photocurable resin composition, the dry film, and the cured product |
| abstract | Disclosed is a photocurable resin composition that can form a dried coating film, which is highly dry to the touch, has high sensitivity, and can form a cured film which is soft and particularly has a high insulating resistance under high temperature and humidified conditions. Also disclosed are a dry film and a cured product of the photocurable resin composition, and a printed wiring board comprising a cured film such as a solder resist formed using the photocurable resin composition, the dry film and the cured product. The photocurable resin composition is alkaline-developable and comprisesa photosensitive resin having a structure represented by general formula (I), a carboxyl group-containing resin, and a photopolymerization initiator. Preferably, the photocurale resin composition further comprises a heat curable component and more preferably further comprises a colorant. In general formula (I), R1s, which may be the same or different, represent a hydrogen atom and an organic group having 1 to 20 carbon atoms; R2 represents at least one functional group selected from the group consisting of alkyl groups having 1 to 10 carbon atoms, alkylene groups having 1 to 10 carbon atoms, and phenylene groups; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R5 represents a hydrogen atom or a methyl group; p is an integer of 1 to 5; q is an integer of 3 or more; m is an integer of 1 to 4; and n is an integer of 1 to 10. |
| priorityDate | 2008-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 507.