http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102248331-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6269547d4876dd2c286e9c7d1441b12b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 |
| filingDate | 2011-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04f145a10bb5982dffb8a00daf8991ea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44a443f2943c17bda7e0aa6765b73cdd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01b5ec357bd6fb3cac7b1ffd88c37e6a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d84138284f134d4b74e783abcc7e7557 |
| publicationDate | 2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102248331-B |
| titleOfInvention | Preparation method of tin-selenium interalloy |
| abstract | The invention discloses a preparation method of a tin-selenium interalloy. The tin-selenium interalloy is prepared by a wrapping and extrusion method. When selenium and tin are exposed to the actions of powerful deformation extrusion friction and heat, selenium is extruded into microparticles of below micrometer scale, and the microparticles are mechanically mixed with tin to form a mixture and dispersed in tin to the greatest extent, so that, when the tin-selenium interalloy is used, the tin-selenium mechanical mixture can be rapidly melted in a lead-free solder alloy melt. The temperature required for the preparation method is lower than the melting point of selenium, so as to prevent selenium from oxidation, vaporization and sublimation and avoid the formation of highly-toxic selenium dioxide, thus the adverse effects on the environment and the operating staff are eliminated and the loss of selenium does not exist. When the tin-selenium interalloy prepared in the invention is used, the time of stirring the applied lead-free solder alloy melt is not less than 10 minutes, so as to ensure alloy components to be more uniform. |
| priorityDate | 2011-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.