Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate |
2011-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c32e76c3e4765e4ee7cf1b736278d917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30efba884c80fdce56d6ca27a7dbf5c3 |
publicationDate |
2015-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-102241807-B |
titleOfInvention |
Epoxy resin composition for optical-semiconductor element encapsulation and optical-semiconductor device using the same |
abstract |
The present invention relates to an epoxy resin composition for optical-semiconductor element encapsulation, including the following ingredients (A), (B) and (C): (A) an epoxy resin; (B) a curing agent including a phenol resin (b1) represented by the following general formula (1), and an acid anhydride (b2) in which R represents -phenyl- or -biphenyl-, and n is 0 or a positive integer; and (C) a curing accelerator, in which a ratio between the number of hydroxyl groups of the ingredient (b1) and the number of hydroxyl groups of the ingredient (b2), in the ingredient (B) is 99.99/0.01 to 50/50 in terms of b1/b2. The invention also provides an optical semiconductor device using the epoxy resin composition. |
priorityDate |
2010-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |