| abstract |
The invention relates to a semiconductor device and a semiconductor packaging structure provided with the same. The semiconductor device comprises a semiconductor substrate, a back surface dielectric layer, a plurality of first back surface under-ball metal welding pads and a first back surface under-ball metal plane. The back surface dielectric layer is adjacent to a back surface of the semiconductor substrate. The first back surface under-ball metal welding pads are located on the back surface dielectric layer. The first back surface under-ball metal plane is located on the back surface dielectric layer and is provided with several puncturing holes. The first back surface under-ball metal welding pads are disposed in the puncturing holes, and a spacing is disposed between the first back surface under-ball metal plane and the first back surface under-ball metal welding pads. Via the above structure, cost of forming the first back surface under-ball metal welding pads and the first back surface under-ball metal plane is low. |