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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-06
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
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filingDate 2011-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102190776-B
titleOfInvention Thermosetting resin composition for optical semiconductor element encapsulation, cured material thereof, and optical semiconductor device obtained using the same
abstract The present invention relates to a thermosetting resin composition for encapsulating optical semiconductor elements, its cured material, and an optical semiconductor device obtained using the same. The thermosetting resin composition comprises the following components (A) to (D): (A) an epoxy group-containing siloxane compound represented by the following general formula (1), wherein R 1 is a compound having 1 to 10 carbons Atomic monovalent hydrocarbon group, R 2 is a divalent hydrocarbon group with 1 to 20 carbon atoms and can contain ether or ester oxygen atoms inside, n is an integer of 0 to 20; (B) acid anhydride curing agent; (C ) a heat-condensable organosiloxane; and (D) a curing accelerator.
priorityDate 2010-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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