| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-455 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
| filingDate |
2009-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_365be5832bf57afb6cddcf703378eddd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_053f0be38dfbd91c3fc0e32042871f6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cd85c71fecdd2163b9e36f37d542fd6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c462962a87f88310df531c36834d93b |
| publicationDate |
2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-102165370-B |
| titleOfInvention |
Photosensitive siloxane polyimide resin composition |
| abstract |
The present invention aims to sufficiently suppress bleedout of a cyclic dimethylsiloxane oligomer, which is an impurity, from a thin protective layer which is obtained by forming, patterning and curing a film of a photosensitive siloxane polyimide resin composition on a printed wiring board. For fulfilling the aim, the photosensitive siloxane polyimide resin composition contains: 100 parts by mass of a siloxane polyimide resin which is obtained by imidizing a tetracarboxylic acid dianhydride, a siloxane diamine having a diphenylsilylene unit and a diamine containing no siloxane; 1-20 parts by mass of at least one kind of crosslinking agent selected from the group consisting of liquid epoxy resins, benzoxazines and resols; and 5-30 parts by mass of a photoacid generator. |
| priorityDate |
2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |