http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102153977-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_643c845523854dcbd565ba6907799a91 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2011-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc04670e2b264e261227e2c24b051094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91bd258bf5cabf4c5a8cfbce3401e459 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4442da559b65f676ff1515c0514b7c5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc7e8ed7e53947969d18b6cceb921775 |
| publicationDate | 2013-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102153977-B |
| titleOfInvention | Anti-seepage leak-stopping epoxy adhesive and preparation method thereof |
| abstract | The invention provides a moisture/water-curable anti-seepage leak-stopping epoxy adhesive which is prepared by complexing epoxy resin, self-toughening phenolic aldehyde amine modified curing agent T31, diluter, mahogany acid, coupling agent, promoter diethylenetriamine, filler cement and auxiliary filler calcium oxide according to a certain mass ratio. After being applied, the anti-seepage leak-stopping epoxy adhesive can be directly cured in water; the bonding strength is improved after curing, and the durability is high; and the adhesive layer ductility is improved without adding other toughener, and better impact ductility is achieved. The steel-steel dry-state adhesive application test on a universal electronic testing machine shows that the shear strength can be up to about 15.0-22.0MPa, the bonding strength is 18.0-21.0MPa after dry-state adhesive application and in-water curing, and the bonding strength is 4.0-7.0MPa after wet-state adhesive application and in-water curing. |
| priorityDate | 2011-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.