| abstract |
Disclosed is an adhesive film for semiconductors, which can be attached to a semiconductor wafer at a low temperature. This adhesive film enables to produce semiconductor chips from a semiconductor wafer with high yield, while sufficiently suppressing occurrence of chip cracks or burrs. Specifically disclosed is an adhesive film for semiconductors, which contains a polyimide resin obtained by a reaction between a tetracarboxylic acid dianhydride containing 4,4'-oxydiphthalic acid dianhydride represented by the chemical formula (I) below and a diamine containing a siloxane diamine represented by the general formula (II) below. This adhesivefilm for semiconductors can be attached to a semiconductor wafer at a temperature not more than 100 DEG C. |