| abstract |
The invention discloses a thermosetting resin composition, which is characterized by comprising the following components in part by weight: 8 to 80 parts of allyl modified bismaleimide resin prepolymer, 15 to 60 parts of cyanate resin and 5 to 40 parts of halogen-free epoxy resin, wherein the allyl modified bismaleimide resin prepolymer is prepared by reacting bismaleimide resin with an allylcompound at the temperature of between 110 and 160DEG C for 20 to 100 minutes, and a weight ratio of the bismaleimide resin to the allylcompound is 100:(30-120). The composition can be used for preparing a prepreg and a laminated board. The composition and the laminated board have excellent humidity resistance, high heat resistance, low water absorption rate, high modulus, lower dielectric constant and dielectric loss, and good processing toughness, and can realize halogen-free flame retardancy. |