http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102112920-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2009-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_227cccc1a2c587aab70e86009025f5d6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25ad94855b347d2a85c74467f86e9ec5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ae233ec4f9cff125dc4a41ddcd5aa4e |
| publicationDate | 2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102112920-B |
| titleOfInvention | Flame-retardant photocurable resin composition, dry film and cured product of same, and printed circuit board using composition thereof |
| abstract | Disclosed is a flame-retardant photocurable resin composition which has a halogen-free composition and thus places little burden on the environment. The flame-retardant photocurable resin composition has excellent flame retardancy and is capable of forming a cured coating film having excellent flexibility. A dry film and cured product of the composition, and a printed wiring board provided with a flame-retardant cured coating film such as a solder resist obtained by using the composition, dry film or cured product are also disclosed. The flame-retardant photocurable resin composition contains (A) an organic solvent-soluble phosphorus-containing polyester, (B) a carboxyl group-containing resin, and (C) a photopolymerization initiator. Preferably, the carboxyl group-containing resin (B) is a carboxyl group-containing polyurethane resin. Preferably, the flame-retardant photocurable resin composition additionally contains (D) a photopolymerizable monomer or (E) a thermosetting resin. The flame-retardant photocurable resin composition, particularly a flame-retardant photocurable/thermosetting resin composition containing the thermosetting resin (E) can be suitably used as a solder resist. |
| priorityDate | 2008-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 233.