http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102093925-B
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_778fe5aa551806ca134b210927ef0eb8 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10M107-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C10M169-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate | 2009-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee8a3d2d27f48425d7fcd58348e535bb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_535f2b3524448fd313ba2ad16cdd71b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c75cb276d20fcd07f42a135fbf13cb12 |
publicationDate | 2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-102093925-B |
titleOfInvention | Solar silicon wafer cutting liquid |
abstract | The invention discloses solar silicon wafer cutting liquid. The solar silicon wafer cutting liquid contains polyethylene glycol, a dispersant, a surfactant, a defoamer and a chelating reagent. The solar silicon wafer cutting liquid can improve the dispersibility and the redispersibility of silicon carbide so as to ensure the stability and the durability of slurry, can realize 100 percent recovery of the silicon carbide, greatly reduces the cost, can reduce the surface damage of a slice and the pollution of mechanical stress, thermal stress and metal ions to a silicon wafer, contributes to subsequent cleaning of the silicon wafer, improves the conversion efficiency of a rear-end solar battery, can effectively improve the thickness error of the silicon wafer and improves cutting yield. |
priorityDate | 2009-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.