http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102084730-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b7317808024e524eea40a6c5a5ad6a22 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10962 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09754 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2009-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b2a48a6114bf5af2291ac3a4c928d13 |
| publicationDate | 2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102084730-B |
| titleOfInvention | A support module, a lighting device, and a method for manufacturing such a lighting device |
| abstract | A support module (1) comprises a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board. |
| priorityDate | 2008-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452055648 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159990 |
Total number of triples: 25.