http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102073004-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e74277852f1aae0a3ff13f59a65456d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e0c4a6c96aec83eac22e4df1db9c826
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_551cfaf1ea109ef05f5288b3ca35d867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2e719bf68da63d44ec2f804bdbcaf87
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publicationDate 2013-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102073004-B
titleOfInvention Method for testing reliability of semiconductor devices
abstract The invention discloses a method for testing reliability of semiconductor devices which have negative bias temperature instability (NBTI). The method comprises the following steps: measuring the NBTI curve of a first set of semiconductor devices; measuring the 1/f noise power spectral density and drain current of the first set of semiconductor devices at a predetermined frequency under the condition that the first set of semiconductor devices is biased in a gate electric field; measuring the equivalent oxide layer thickness of the gate dielectric of the first set of semiconductor devices; measuring the 1/f noise power spectral density and drain current of a second set of semiconductor devices at the predetermined frequency under the condition that the second set of semiconductor devices is biased in the gate electric field; measuring the equivalent oxide layer thickness of the gate dielectric of the second set of semiconductor devices; and evaluating the deterioration characteristic of the second set of semiconductor devices by using the NBTI curve of the first set of semiconductor devices. The method disclosed by the invention saves the time required for testing the reliability of a large number of semiconductor devices, and can not damage the second set of semiconductor devices.
priorityDate 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 20.