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filingDate 2009-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0d250b39e0016b4a7d69e84ce4b3e19
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publicationDate 2013-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-102015531-B
titleOfInvention Amorphous siliceous powder, process for production of the same, and use thereof
abstract Provided are a resin composition, particularly a semiconductor encapsulation material, which exhibits a low viscosity in encapsulation even when highly loaded with an inorganic filler and which is further improved in moldability; and an amorphous siliceous powder suitable for the preparation of the resin composition; and a process for the production of the amorphous siliceous powder. The amorphous siliceous powder has an L/B ratio of 0.8 or below (wherein L is quantity of desorbed pyridine as observed in subjecting an amorphous siliceous powder containing pyridine adsorbed thereon to heating at 450 DEG C to less than 550 DEG C; and B is quantity of desorbed pyridine as observed in subjecting the same to heating at 150 DEG C to less than 250 DEG C). It is preferable that the ratio of the quantity (B) of desorbed pyridine as observed in heating at 150 DEG C to less than 250 DEG C to the total quantity (A) of desorbed pyridine as observed in heating at 150 DEG C to less than 550 DEG C, (B/A)100%, be 20% or above. Further, it is preferable that the amorphous siliceous powder have a specific surface area of 0.5 to 45m2/g, a mean particle diameter of 0.1 to 60[mu]m, and an average sphericity of 0.80 or above.
priorityDate 2008-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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