http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101983435-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate | 2009-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b43049f355611b10f257105a43fddd0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef581cc2d96964b509a5f49aa0d23a98 |
| publicationDate | 2013-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-101983435-B |
| titleOfInvention | Package for optical semiconductor device, optical semiconductor device using the package, and methods for producing same |
| abstract | Disclosed is a package for optical semiconductor devices, which can prevent discoloration of a plating layer formed on a lead frame even when a silicone resin is used as a sealing resin for an optical semiconductor device, and which enables high luminous efficiency for a long time. Also disclosed is an optical semiconductor device using the package for optical semiconductor devices. In the package for semiconductor devices, a plating laminate (15), wherein a pure Ag plating layer (4), a thin reflective plating layer (6) serving as the uppermost layer for improving the light reflection ratio, and a resistant plating layer (5) serving as an intermediate layer therebetween and having chemical resistance against at least either metal chlorides or metal sulfides are laminated, is formed on at least the surface of a lead electrode. The reflective plating layer (4) is composed of a pure Ag thin film, and the resistant plating layer (5) is composed of a complete solid solution Au-Ag alloy plating layer. |
| priorityDate | 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.