| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2009-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_866960e4aae9d9ad73984f04b7b5791f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a06e2991eacce552b9fa0a87c0d1b86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_897147eff68ce72e2e6407a064c3edc3 |
| publicationDate |
2012-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-101970526-B |
| titleOfInvention |
Epoxy resin composition and molded object |
| abstract |
An epoxy resin composition having excellent moldability is provided. When combined with an inorganic filler, the epoxy resin composition gives a cured object which has a high thermal conductivity and low thermal expansion and is excellent in heat resistance and moisture resistance. The epoxy resin composition comprises an epoxy resin (A) and a hardener (B), wherein at least 50 wt.% of the epoxy resin is accounted for by a 4,4'-benzophenone epoxy resin and at least 50 wt.% of the hardener is accounted for by a 4,4'-benzophenone phenolic resin. In the composition, the ratio of the epoxy groups of the epoxy resin to the functional groups of the hardener is in the range of 0.8-1.5 by equivalent. This epoxy resin composition can contain 50-95 wt.% inorganic filler and is suitable for use in semiconductor encapsulation. |
| priorityDate |
2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |