http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101970142-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_964715652eb394808baf941c5b3eb33a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21C23-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21F29-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21J5-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21C23-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21C23-002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C48-92 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B21C23-00 |
| filingDate | 2008-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4eb366926dc2c86e152cb6a8f81914a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70fdda90160adfc2b802843e3fabcba1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75ee97402219ad3b19f578821496f2a4 |
| publicationDate | 2014-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-101970142-B |
| titleOfInvention | Forming device for thixoextrusion and method thereof |
| abstract | Thixoextrusion molding apparatuses and methods are provided. One embodiment of the apparatuses comprises: a container having a first through-hole storing a semi-solid billet therein and a heater installed outside the first through-hole to maintain the temperature of the semi-solid billet constant; a stem insertable into the first through-hole from the front of the container to pressurize the semi-solid billet in the backward direction; a die body coupled to the back of the container and having a second through-hole, which is in communication with the first through-hole of the container and has a smaller diameter than the first through-hole of the container, through which the semi-solid billet is extruded and a plurality of thermocouple insertion holes including a first thermocouple insertion hole and a second thermocouple insertion hole, the first thermocouple insertion hole being used for measuring the temperature of the die body, and the second thermocouple insertion hole being used for measuring the temperature of the semi-solid billet; a die body support coupled to the back of the die body inside the die ring and having a plurality of coolant inflow-outflow holes so as to change the phase of the extruded semi-solid billet to a solid extrudate; a die ring surrounding the die body and the die body support and having a plurality of coolant inflow-outflow holes to prevent thermal deformation in the circumferential direction; a die balance support held in close contact with the die body support and coupled to the back of the die ring; and a cooling unit coupled to the die balance support to cool the solid extrudate. According to the apparatuses and methods, metals can be molded under a low extrusion pressure, the life of the apparatuses is prolonged, the strength of the metal products is improved, the ignition of the metals is inhibited during processing, the amount of a protective gas used is reduced, and the formation of welding lines is inhibited. |
| priorityDate | 2008-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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