http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101966632-B
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4c217a0c6e721e9c03b875be4c4ade64 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-362 |
filingDate | 2010-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2013-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd2c6f6461f8c05899656a3ae5676ba2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c72e6662f3764710c1744ae7312cddea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be863b6727d3e1881aac80c151fb7ee4 |
publicationDate | 2013-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-101966632-B |
titleOfInvention | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof |
abstract | The invention discloses a wash-free soldering flux for leadless low-temperature soldering paste, which comprises the following components in percentage by weight: 27 to 37 percent of modified abietic resin, 10 to 12 percent of thixotropic agent, 8 to 12 percent of tackifier, 10 to 12 percent of organic activator, 0.5 to 2.0 percent of lube and the balance of organic solvent. The invention also discloses a preparation method of the wash-free soldering flux for the leadless low-temperature soldering paste. The soldering flux in the invention can keep high application characteristics for a long time under the working conditions of an environmental temperature of less than or equal to 30 DEG C and humidity of more than or equal to 80 percent and is particularly suitable for preparing the low-temperature soldering paste from high Bi content-containing alloy systems such as Sn-58Bi, Sn-57Bi-1.0Ag, Sn-35Bi-1.0Ag. |
priorityDate | 2010-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.