| abstract |
The invention relates to a fluid medium for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and at least one organic compound with low volatility. Systems of this type can be used either for cleaning, the removal of defects and the texturing of wafer surfaces in a single etching step or, exclusively, for the texturing of silicon wafers having different surface qualities, such as wafers which are cut by a wire saw and exhibit high surface degradation or chemically polished surfaces having a minimal number of defects. |