| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
| filingDate |
2008-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15c841eb3115df575f3bb5445d919a13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21a50955c5a6f2382eb2e0d11ae90093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b3dc79f67d62759c679258c526a2c98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5d0feaf1b8e6476c8b3d99a84d7ec26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74b01df98abc3d58462e7d2975de5b8f |
| publicationDate |
2014-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-101919008-B |
| titleOfInvention |
Methods of treating a surface to promote metal plating and devices formed |
| abstract |
Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules. |
| priorityDate |
2007-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |