| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_43d5505552431965c7ea915f32646405 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4854
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-698
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-2865
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-2825 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-10 |
| filingDate |
2008-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7390eb8cf6f15f94bb31f9fddfa1c6a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e95a13807553a33dd243c337608c905
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51885f701a5dc1151509a294eb7036b6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b01370b50a233ec1f43f9693611f70c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e2ddc61dd3ad8c67659d07dd27760a9 |
| publicationDate |
2013-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-101861345-B |
| titleOfInvention |
Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator |
| abstract |
The present invention relates to heat-curing epoxy resin compositions, which are characterized in particular by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are particularly suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions. |
| priorityDate |
2007-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |