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filingDate 2010-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fc287089baf42f2e2935fc10396e9aa
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publicationDate 2015-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-101800277-B
titleOfInvention Light emitting device and light emitting device package
abstract A light emitting device is provided. The light emitting device comprises: a conductive support substrate; a bonding layer on the conductive support substrate; a reflective layer on the bonding layer; and a light emitting structure layer on the reflective layer. The bonding layer comprises a solder bonding layer on the conductive support substrate and at least one of a diffusion barrier layer and an adhesion layer on the solder bonding layer, the solder bonding layer, the diffusion barrier layer, and the adhesion layer being formed of a metal or an alloy of which the Young's Modulus is 9 GPa to 200 GPa.
priorityDate 2009-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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