http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101792632-B

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D133-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D133-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-08
filingDate 2010-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2014-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-101792632-B
titleOfInvention Primer composition and optical semiconductor device using the same
abstract The invention provides a primer composition and an optical semiconductor device using the same. The primer composition is a primer composition used to bond a substrate and a solidified matter, wherein the substrate is a substrate mounted with the optical semiconductor device, and the solidified matter is a solidified matter for sealing addition reaction curing type organosilicon composition of the optical semiconductor component. The primer composition contains: (A) a homopolymer of (meth) acrylates, each one molecule of which contains at least one hydrogen atom bonded with the silicon atom, or a copolymer formed by (meth) acrylates containing the hydrogen atom bonded with the silicon atom, and at least one selected from the acrylate or methacrylate; and (B) solvent. The primer composition can improve the bonding character between the substrate mounted with the optical semiconductor component, and the solidified matter for sealing addition reaction curing type organosilicon composition of the optical semiconductor component, and simultaneously can prevent the corrosion of the metal electrode formed on the prevent substrate.
priorityDate 2009-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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