http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101730624-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20688220cab72ad01902ff5223732946 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2425-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2519-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2429-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2309-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-223 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-18 |
| filingDate | 2008-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3f7f1016adfda054208579949d96f25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_089a56038581205a4ca8e7d3440049eb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00a2f5ebe40ec1a995b0372bf3edc26a |
| publicationDate | 2013-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-101730624-B |
| titleOfInvention | Smart information carrier and production process therefor |
| abstract | A smart information carrier comprising a security element and a method its production comprising: security printing at least one side of a natural or synthetic fibre-containing continuous support; if only one side of the support is security printed the non-security-printed side of the support is placed on the lower melting point side of a two polymer laminate with the high melting point side having a melting point higher than 150 DEG C and an IC-module comprising an electronic chip and an antenna integrated therein is placed on the other side of the support; placing a further sheet of a two polymer laminate with the high melting point side having a melting point higher than 150 DEG C on the IC-module with the lower melting point side nearer the IC-module with at least one sheet of a polymer foil with a melting point of up to 150 DEG C between the IC-module and the lower melting point-side of the further sheet of a two-polymer laminate; laminating the resulting sandwich in a laminator. |
| priorityDate | 2007-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.