http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101728312-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-20
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762
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filingDate 2009-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e432e03d83281a7953d3188091956c0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed3c4bef2ce802a600b9fe85c40e4ed1
publicationDate 2014-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-101728312-B
titleOfInvention SOI substrate and method for manufacturing same
abstract The object of the invention is to provide an SOI substrate having a high mechanical strength, and a method for manufacturing the SOI substrate, a single crystal semiconductor substrate is irradiated with accelerated ions so that an embrittled region is formed in a region at a predetermined depth from a surface of the single crystal semiconductor substrate; the single crystal semiconductor substrate is bonded to a base substrate with an insulating layer interposed therebetween; the single crystal semiconductor substrate is heated to be separated along the embrittled region, so that a semiconductor layer is provided over the base substrate with the insulating layer interposed therebetween; and a surface of the semiconductor layer is irradiated with a laser beam so that at least a superficial part of the semiconductor layer is melted, whereby at least one of nitrogen, oxygen, and carbon is solid-dissolved in the semiconductor layer.
priorityDate 2008-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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