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filingDate 2009-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c598f74960743a370d926185e50d9112
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publicationDate 2013-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-101661882-B
titleOfInvention Semiconductor element and its manufacturing method
abstract The invention provides a semiconductor element and its manufacturing method. A high-k metal gate structure of the sSemiconductor element includes a buffer layer. The buffer layer may interpose an interface oxide layer and a high-k gate dielectric layer. In one embodiment, the buffer layer includes an aluminum oxide. The buffer layer and the high-k gate dielectric layer may be formed in-situ using an atomic layer deposition (ALD) process. The semiconductor element has advantages of reducing the local stress between the gate dielectric layer (such as high-k material) and an interface layer (such as oxide); decreasing the influence to the threshold voltage (Vt) owing to the gate line width and improving the narrow channel effect.
priorityDate 2008-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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