| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_072b012b7e1089596ebd44a29b461fc4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F281-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F38-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-00 |
| filingDate |
2008-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75b1937c4c8275fde20486bfc59edd23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_160b663a4e3e2e4aaf095deddb3069a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b675942fc25077c99f5c657fd94981f5 |
| publicationDate |
2012-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-101646697-B |
| titleOfInvention |
Organic insulating material, varnish for resin film using the same, resin film and semiconductor device |
| abstract |
Disclosed is a useful organic insulating material having low dielectric constant, high heat resistance and high mechanical strength. Also disclosed are a resin film using the organic insulating material and a semiconductor device. The organic insulating material contains a prepolymer composed of an adamantane structure compound having a group containing a polymerizable unsaturated bond. The prepolymer has a number average molecular weight of not less than 2,000 but not more than 500,000 in terms of polystyrene as determined by gel permeation chromatography. The group containing a polymerizable unsaturated bond is preferably a group containing a carbon-carbon triple bond. The resin film is obtained by a crosslinking reaction and a condensation reaction of the organic insulating material or a varnish for resin films containing the organic insulating material, which reactions are caused by heating and/or irradiation of an active radiation ray. |
| priorityDate |
2007-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |