http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101600300-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a4c4485ed7c5ee76995ee06fd5aef015 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2008-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b80d6263992979e9fd41bd5afd42110d |
| publicationDate | 2009-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-101600300-A |
| titleOfInvention | The manufacture method of buried circuit structure |
| abstract | A kind of manufacture method of buried circuit structure.At first, provide substrate, it has upper surface and lower surface, and upper surface is with respect to lower surface.Then, form dielectric layer on the upper surface of substrate.Then, form resistance coating on dielectric layer.Afterwards, patterning resistance coating and dielectric layer are to form groove pattern on dielectric layer.Then, chemically form end conductive layer in groove pattern, and end conductive layer exposes resistance coating.Then, remove resistance coating. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102215634-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102196673-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102196673-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102695371-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102695371-A |
| priorityDate | 2008-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.