http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101569966-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 |
| filingDate | 2009-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-101569966-B |
| titleOfInvention | A kind of lead-free tin cream |
| abstract | The invention discloses the preparation method of a kind of lead-free tin cream and scaling powder thereof, rosin, organic acid, nonionic halide, thixotropic agent and each component of organic amine compound are weighed heating for dissolving and uniformly save backup at 5-10 DEG C after liquid by proportion; Weight is accounted for the glass putty of 80%-85%, bismuth weight accounts for the bismuth meal of 15%-20%, and the copper powder that weight accounts for 0.3%-0.8% is thoroughly mixed to form tin bismuth copper alloy powder; The tin bismuth copper alloy spherical powder of the above-mentioned lead-free tin cream of 80%-95% is thoroughly mixed with the above-mentioned colophony type scaling powder of 5%-20%, to prepare lead-free tin cream of the present invention.Tin bismuth copper (Sn82.5%Bi17%Cu0.5%) alloy melting point that the present invention uses is 190-209 DEG C, close to tin lead (Sn63/Pb37) alloy melting point, the scaling powder used is made up of the active system of particular design, can make the novel lead-free tin cream being applicable to tin lead (Sn63/Pb37) tin cream reflow welding temperature curve. |
| priorityDate | 2009-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.