| abstract |
The present invention relates to etching liquid cuprum wiring forming method by using the same. the present invention provides etching liquid capable of forming cuprum wiring with few undercut and few pit and excellent rectilinearity, and cuprum wiring forming method by using the etching liquid. The etching liquid is cupreous etching liquid containing acid, cupric ion source, tetrazole and water, containing polymer possessing the followed formula (I) functional group in the composition unit. |