| abstract |
The invention provides a coating fluid containing a metallic material which reacts with a ligand represented by 1,2-benzenediol, phenylenediamine, 2-aminophenol, 2-aminothiphenol, anthranilic acid, salicylic acid, thiosalicylic acid, etc. and comprises indium (In), tin (Sn), or both indium (In) and tin (Sn). Also provided are: a method of forming a conductive thin film which comprises applying the coating fluid to a base surface to form a coating film and burning it to thereby change the one or more members selected from the group consisting of the metallic materials and contained in the coating film into a conductive thin film; and a conductive thin film obtained by the production process. The conductive thin film can have high transparency and high conductivity and have high adhesion to the base.The present invention provides a technology related to a conductive film which is high in transparency, conductivity, and adhesiveness to a base plate. |