| abstract |
The invention provides a positive photosensitivity polyamide acid ester resin composition, a preparation method and application thereof. The resin composition comprises the following components in portion by weight: 10 to 70 portions of the soluble polyamide acid ester resin, 100 to 1,000 portions of an organic solvent, 0.1 to 50 portions of a photosencitizer, 0.1 to 50 portions of a photosensitizer additive, and 0.1 to 50 portions of a built-in adhesion promoter, wherein the soluble polyamide acid ester resin is prepared from aromatic diacid chloride diester containing fluorin, aromatic diamine and mixture thereof, and a molecular weight conditioning agent. The positive photosensitivity polyamide acid ester resin performs a photodegradation reaction after exposure through ultraviolet ray (i ray and g ray), and after an exposure area is dissolved by an aqueous solvent, a pattern with high resolution can be obtained. Furthermore, a polyimide layer membrane formed after being heated and cured has low specific inductive capacity, low water absorbing capacity, excellent thermal stability, mechanical performance and optical performance. |