http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101470097-B
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e1c660179935c4cddcbbda6d455b71d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-48 |
filingDate | 2007-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2013-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5bcd38546cf573b940cfae46cd37cec http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a5779e0ee0cda82930310b60f4f10e1 |
publicationDate | 2013-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-101470097-B |
titleOfInvention | Measuring method for concentration of organic additive in plating solution |
abstract | A test method for the concentration of organic additive in electroplating solution comprises: comparing the peak potential of an organic additive in an object electroplating solution with a standard curve of the organic additive, to determine the concentration of the organic additive in the object electroplating solution, wherein the standard curve of the organic additive reflects the relationship between the concentration and the peak potential of the organic additive in the object electroplating solution, and the peak potential is tested by cyclic volt-ampere dissection method or cyclic pulse volt-ampere dissection method. The test method on the concentration of organic additive in electroplating solution is simple and fast with low error. |
priorityDate | 2007-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.