http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101469253-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
filingDate 2008-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-101469253-B
titleOfInvention Composition for polishing
abstract The present invention relates to composition for polishing.The invention provides composition for polishing, it can take into account and suppresses the generation of surface step degree and realize high grinding rate in the grinding step preparing wiring structure.Composition for polishing; its contain abrasive material, processing promotor, with R-POE (in formula, R represents that the carbonatoms with branched structure is the alkyl of 10 ~ 16, and POE represents polyoxyethylene chain) expression and HLB be 7 ~ 12 nonionogenic tenside, anion surfactant, protective membrane forming agent, oxygenant and water.
priorityDate 2007-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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